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LTC3212
PIN FUNCTIONS
CP, CM (Pins 1, 11): Charge Pump Flying Capacitor Pins.
A 1μF X5R or X7R ceramic capacitor should be connected
from CP to CM.
CPO (Pin 2): CPO is the output of the charge pump. A 1μF
X5R or X7R ceramic capacitor is required from CPO to
GND. While operating, this pin will supply current to the
LEDs and while in shutdown mode this pin will be high
impedance.
LEDEN (Pin 3): The LEDEN pin is used to program, enable
and shut down the part. A 3μA internal current source
pulls this pin to ground.
I SETB , I SETR , I SETG (Pins 4, 5, 6): LED current program-
ming resistor pins. A resistor connected between a pin
and GND is used to set the LED current. A resistor from
I SETG to GND is required. Resistors on I SETR and I SETB
are optional. If I SETR and/or I SETB is not connected to a
resistor I SETR ’s and/or I SETB ’s respective output(s) will be
automatically programmed by the resistor connected to
I SETG . If I SETR or I SETB is unused the pin should be con-
nected to V IN .
LEDG, LEDR, LEDB (Pins 7, 8, 9): These pins are
the LED current output pins. The LEDs are connected
from either the charge pump or V IN (anode) to LED
(R, G, B) (cathode).
GND (Pin 10): This pin should be connected directly to a
low impedance ground plane.
V IN (Pin 12): Supply voltage for the LTC3212. V IN should
be bypassed with a low impedance ceramic capacitor to
GND of at least 1μF of capacitance.
Exposed Pad (Pin 13) : GND. The Exposed Pad must be
soldered to a low impedance ground plane for optimum
performance.
3212fb
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